SCHNAP Logo

Christmas/New Year Delay Notice: Many suppliers are closed 22 Dec – 15 Jan. Some orders may experience delays.
Christmas/New Year Delay Notice: Many suppliers are closed 22 Dec – 15 Jan. Some orders may experience delays.
Making Trade Life Easy!
Trade Discount 20%

3D Object Detection Core | Time-of-Flight Sensor | IP65/IP67/IP69 Rated | Integrated Infrared Laser | by SICK

BRAND: SICK
SKU: 1137062
$6,030.90 List price: $7,580.20
+
The 3D Object Detection Core is designed for advanced collision avoidance and industrial automation applications. Featuring time-of-flight technology with a working range of up to 9 meters and a field of view of 70° x 60°, this sensor ensures precise detection and navigation. With an IP65/IP67/IP69 rated enclosure and low power consumption, it’s perfect for mobile platforms and harsh environments.
Technical Specifications
  • Technology: 3D snapshot time-of-flight
  • Working range: up to 9 meters
  • Field of view: 70° x 60°
  • Angular resolution: 0.14° x 0.14°
  • Illumination: Integrated infrared laser, 855 nm ± 5 nm
  • Laser class: Class 1, P0 < 17 mW, t < 25 ns (IEC 60825-1:2014)
  • Connection type: M12, 8-pin, A-coded and X-coded Gigabit Ethernet
  • Supply voltage: 24 V DC
  • Power consumption: Typical 12 W, < 8 W in energy saving mode
  • Peak current: 2 A
  • Enclosure rating: IP65, IP67, IP69
  • Protection class: III
  • Housing color: Blue, black
  • Window material: PMMA
  • Sensor resolution: 512 px x 424 px
  • Processor: 1.8 GHz, 4× ARM Cortex
  • Scan/frame rate: up to 30 fps
  • Exposure time: ≤ 10 ms
  • Repeatability: Approx. 0.8 mm at 1 m, approx. 5 mm at 7 m
  • Switch-on delay: Approx. 20 s
  • Response time: ≥ 100 ms for 4 fields
  • Digital inputs/outputs: 6, max 100 mA per output, short-circuit protected
  • Optical indicators: 4 status LEDs
  • Operating temperature: -10 °C to +50 °C
  • Storage temperature: -20 °C to +80 °C
  • Relative humidity: ≤ 95% non-condensing
  • Electromagnetic compatibility: IEC 61000-6-4:2018 / IEC 61000-6-2:2016
  • Dimensions (H x L x W): 77mm x 80mm x 70mm
  • Weight: 0.52 kg
Key Features
  • 3D snapshot time-of-flight technology
  • Pre-calibrated and programmable sensor
  • Integrated infrared laser illumination (855 nm)
  • Field of view: 70° x 60° with 0.14° angular resolution
  • High sensor resolution of 512 px x 424 px
  • IP65, IP67, and IP69 rated enclosure for robust protection
  • Supports Ethernet TCP/IP, UDP/IP and REST API
  • Low power consumption with energy saving mode
  • Integrated 3D Object Detection SensorApp for flexible collision avoidance
Professional Installation Requirements
  • Installation by qualified personnel recommended to ensure proper integration and compliance with safety standards.
Applications
  • Collision avoidance on mobile platforms
  • 3D object detection for industrial automation
  • Position determination and navigation guidance
Standards & Compliance
  • AS/NZS 4801 – Occupational Health & Safety Management Systems
Environmental Benefits
  • Energy-efficient operation reduces power consumption
  • Durable IP-rated housing extends product lifespan, reducing waste
Warranty Information

Warranty details available upon request from manufacturer.

Available Now

The SICK V3S145-1AAAABA OD Core is available for immediate purchase, ideal for industrial automation and mobile platform collision avoidance applications.