Trade Discount 17%
Copper C Connector 50-120mm2 | 99.9% High Conductivity | Tamper Proof & Corrosion Resistant by Cabac
The Cabac Copper 'C' Connector is a heavy-duty, corrosion resistant connector designed for high current jointing or tapping of buried copper earthing grids and earth rods, ensuring durable and tamper-proof earthing connections.
Please sign in so that we can notify you about a reply
Sign in
Please login to continue to your account.
Product Name/Title: CCon 50-120mm2run 120mm2Tap
Brand: Cabac
SKU: CAEC120
Alternatively Known As: Copper C Connector, Earth Rod Connector, Copper Earthing Connector, C Tap Connector
Technical Specifications
- Material: 99.9%+ high conductivity copper
- Tap size range: 1.5 to 120mm
- Run size: 120mm
- Compatible earth rod diameter: 13 to 15mm
- Pre-loaded with jointing compound
- Crimping method: Oval dies with 13 Tonne tool
- Dimensions (H x L x W): 50mm x 120mm x 120mm
- Weight: 0.2 kg
Key Features
- Made from 99.9%+ high conductivity copper
- Pre-loaded with jointing compound for enhanced corrosion resistance
- Tamper proof and suitable for direct burial
- Designed for tapping copper conductors from 1.5 to 120mm
- Compatible with standard 13 Tonne crimping tools with oval dies
Professional Installation Requirements
- Installation requires professional crimping using a 13 Tonne crimping tool with oval dies to ensure secure and compliant connections.
Applications
- Buried copper earthing grids
- Earth rods with diameter 13 to 15mm
- Earthing networks requiring corrosion resistant and high current jointing or tapping
Standards & Compliance
- Complies with AS/NZS 3000 – Wiring Rules (Electrical Installation)
Environmental Benefits
- Corrosion resistance extends product life reducing waste
- High conductivity copper reduces energy loss in earthing systems
Warranty Information
Warranty details available upon request from manufacturer.
Available Now
The Cabac CCon 50-120mm2run 120mm2Tap Copper 'C' Connector is available for immediate purchase, ideal for electrical earthing and bonding applications.
