Trade Discount 25%
Soldersleeve Connector Red 0.5-1.0mm2 Adhesive-Lined Cabac
Cabac Soldersleeve Red 0.5 - 1.0mm2 is an adhesive lined heatshrink tube with low melt point fluxed solder sleeve, providing sealed
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Technical Specifications
- Melting temperature: 126 to 145°C
- Temperature rating: -55 to +95°C
- Dielectric strength: 15 kV/mm
- Insulation resistance: 10^14 Meg Ohms
- Mil Spec of Tubing: MIL-I-23053/4, Class 1 AMS-3634
- Mil Spec of Solder: QQ5571E, MIL-S-14256
- Dimensions (H x L x W): 5mm x 50mm x 20mm
- Weight: 0.1 kg
Key Features
- Completely sealed soldered joint created in one go
- Adhesive lined heatshrink tube with internal glue liner that melts and seals the joint
- Provides good strain relief and high vibration resistance
- Fast and efficient method for joining two conductors
- Ideal for connections in hostile or moist environments
Professional Installation Requirements
- Installation requires stripping conductors to 9mm, sliding sleeve over wires, applying heat with a heat gun at approximately 250°C to melt solder and shrink tubing. Avoid open flames. Recommended to be installed by a qualified electrician for safety and compliance.
Applications
- Electrical wiring connections requiring sealed and reliable joints
- Automotive and marine wiring harness repairs
- Industrial and commercial electrical installations in hostile or moist environments
- General purpose wire splicing with vibration resistance
Standards & Compliance
- AS/NZS 3000 – Wiring Rules (Electrical Installation)
Environmental Benefits
- Reduces waste by providing durable, long-lasting wire connections
- Minimizes need for additional connectors or mechanical splices
- Sealed joints prevent corrosion, extending wire life and reducing replacement frequency
Warranty Information
Standard manufacturer warranty applies. Please refer to Cabac warranty policy for details.
Available Now
The Cabac Soldersleeve Red 0.5 - 1.0mm2 is available for immediate purchase. Ideal for electrical splicing applications in residential, commercial, and industrial environments.
