Modular Connection Module CDM490-0001 IP65 Rated Multiple Interface Options SICK
The Modular Connection Module CDM490-0001 is designed for seamless sensor connectivity in industrial automation.
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- Power consumption: Sensor power consumption + 0.5 W
- Housing material: Polycarbonate
- Enclosure rating: IP65
- Protection class: III
- Scanner connection: 15-pin D-Sub HD female and male connectors
- Service plug: 9-pin D-Sub plug (internal)
- Interfaces: Ethernet, RS-232, RS-422, RS-485, CAN, PROFIBUS DP, DeviceNet™
- Optical indicators: 11 LEDs
- Ambient operating temperature: -35 °C to +40 °C
- Storage temperature: -20 °C to +70 °C
- Permissible relative humidity: < 90%, non-condensing
- Configuration software: SOPAS ET
- Dimensions (H x L x W): 70mm x 192mm x 167mm
- Weight: 0.87 kg
- Modular connection module designed for one sensor
- Supports cloning module (CMC), display module (CMD), power supply module (CMP), and fieldbus gateway (CMF)
- Compatible with PROFIBUS DP, Ethernet, and DeviceNet™ fieldbus systems
- Robust polycarbonate housing with IP65 enclosure rating
- Multiple interface options including Ethernet, RS-232, RS-422, RS-485, CAN
- 11 LED optical indicators for status monitoring
- Configuration via SOPAS ET software
- Installation should be performed by a qualified technician familiar with industrial sensor systems and electrical standards.
- Industrial automation sensor connectivity
- Integration with CLV69x and LMS400 sensor products
- Fieldbus communication in manufacturing environments
- Complies with AS/NZS 3000 – Wiring Rules (Electrical Installation)
- Complies with AS/NZS 3112 – Plugs and Socket-Outlets (Type I Plug)
- Durable polycarbonate housing extends product lifespan reducing waste
- Supports efficient sensor integration reducing system complexity and energy use
Standard manufacturer warranty applies; please refer to SICK's official warranty policy.
The SICK CDM490-0001 Modular Connection Module is available for immediate purchase, ideal for industrial automation and sensor integration applications.
